.
A D V A N C E D C O M P U T E R - A I D E D E N G I N E E R I N G S O L U T I O N S
H A V E a Q U E S T I O N ?
Fill out the following form to request additional information on the capabilities of CAESIM
E X P L O R E U N L I M I T E D S I M U L A T I O N P O S S I B I L I T I E S !
C O M P U T E R - A I D E D E N G I N E E R I N G S I M U L A T IO N P L A T F O R M
F L U I D F L O W, H E A T T R A N S F E R, A N D M U L T I - P H Y S I C S
As the electronics industry tends to put more components into a smaller space, thermal management has become one of the key factors in designing the new generation of computers and many other electronic devices. Computational fluid dynamics simulations can help optimize cooling system design, thereby increasing components lifetimes and minimizing the possibility of hardware errors.
CAESIM has been used for simulating air flow and heat transfer of electronic systems including: heat sinks, individual components, multi-chip modules, and computer boards. As electronics are put into a smaller spaces, thermal management becomes a key factor in designing the new generation of computers.
Electronics Applications
CAE has been utilized to simulate conductive and convective heat transfer for a magnetic assembly configuration. The magnetic assembly is comprised of many components made of aluminum, copper, ferrite, and paper. Volumetric heat sources are added for the heat generating assembly components.
CAE has been utilized to simulate a filter device with various heat loads (e.g., 0.25 W). An external heat load is applied, and a bi-conjugate linear equation solver is used to obtain fast solution convergence to steady-state conditions.
CAE simulations are widely used to evaluate/validate thermal conditions in computer server rooms. Performance of computer rack system configurations with varying heat loads can be assessed quickly and accurately.
Electronics Simulations
Additional Information
© 2024 Adaptive Research. All rights reserved.