CAESIM Simulation Platform

A D V A N C E D C O M P U T E R - A I D E D E N G I N E E R I N G S O L U T I O N S

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E X P L O R E U N L I M I T E D S I M U L A T I O N P O S S I B I L I T I E S !

C O M P U T E R - A I D E D E N G I N E E R I N G S I M U L A T IO N P L A T F O R M

F L U I D F L O W, H E A T T R A N S F E R, A N D M U L T I - P H Y S I C S

S I D E V I E W

Heat Conduction

I S O V I E W

Pressure Fields

H E A T S O U R C E

Thermal Transport

E L E C T R O N I C S C O O L I N G

CAESIM has been used for simulating air flow and heat transfer of electronic systems including: heat sinks, individual components, multi-chip modules, and computer boards. As electronics are put into smaller spaces, thermal management becomes a key factor in designing the new generation of computers. CAE simulations help optimize cooling system design, increasing components lifetimes and minimizing the possibility of hardware errors.

CAESIM has been utilized to simulate conductive, convective, and radiative heat transfer for a numerous electronics components.

E L E C T R I C D I O D E

Heat Convections

3 D - V I E W

Tower Computer

C O N V E C T I V E H E A T

Magnetic Assembly

CAESIM Applications

License Information

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I S O V I E W

H E A T S O U R C E

E L E C T R O N I C S C O O L I N G

E L E C T R I C D I O D E

3 D - V I E W

C O N V E C T I V E H E A T

L I C E N S E I N F O R M A T I O N

CAESIM Student License

CAESIM Standard License

CAESIM Advanced License

C O M P A N Y I N F O R M A T I O N